SikaBond®-52 Parquet
SikaBond®-52 Parquet is a 1-component, solvent-free, wood flooring adhesive with good initial tack and low sag flow.
- Adhesive can be sanded
- Floors can be sanded after 12 hours
- Elastic, footfall-sound dampening properties
- Suitable for bonding directly onto old ceramic tiles
- Suitable for use with underfloor heating
- Very low emissions
- Reduces stress transfer between the wood floor and the substrate
Usage
SikaBond®-52 Parquet is designed for full surface bonding with SikaBond® Dispenser:- Solid and engineered wood floors, mosaic parquet, industrial parquet, lam parquet and chipboard floor systems and subfloors.
- Solid wood boards, 3-ply engineered wood and chipboard floor systems and subfloors.
Advantages
- Adhesive can be sanded
- Floors can be sanded after 12 hours
- Elastic, footfall-sound dampening properties
- Suitable for bonding directly onto old ceramic tiles
- Suitable for use with underfloor heating
- Very low emissions
- Reduces stress transfer between the wood floor and the substrate
Packaging
600 ml foil pack / 790 g, 20 foil packs per box
Colour
Parquet brown
Product Details
ENVIRONMENTAL INFORMATION
- EMICODE EC1PLUS R
- LEED® EQc 4.1
- SCAQMD, Rule 1168
- BAAQMD, Reg. 8, Rule 51
Chemical Base
i-Cure Technology polyurethane
Shelf Life
SikaBond®-52 Parquet has a shelf life of 12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.
Storage Conditions
SikaBond®-52 Parquet shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.
Density
1.30 kg/l approx. | (ISO 1183-1) |
Shore A Hardness
35 approx. (after 28 days) | (ISO 868) |
Tensile Strength
1.4 N/mm2 approx. | (ISO 37) |
Shear Strength
1.1 N/mm2 approx., 1 mm adhesive thickness | (ISO 17178) |
Service Temperature
+5 °C to +40 °C
Application
Sag Flow
SikaBond®-52 Parquet maintains stable trowel marks.
SikaBond®-52 Parquet is easily applied using guns or SikaBond® Dispensers.
Ambient Air Temperature
+15 °C to +35 °C
Relative Air Humidity
40% to 70%
Substrate Temperature
During laying and until SikaBond®-52 Parquet has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C without and between +20 °C and +35 °C with underfloor heating.
Substrate Moisture Content
Permissible substrate moisture content without underfloor heating:
- 2.5% CM for cement screeds.
- 0.5% CM for anhydrite screeds.
- 3–12% CM for magnetite flooring (depending on the organic content).
Permissible substrate moisture content for use with underfloor heating:
- 1.8% CM for cement screeds.
- 0.3% CM for anhydrite screeds.
- 3–12% CM for magnetite flooring (depending on the organic content).
Note: For all moisture contents, the quality of the substrates and surfaces, always follow the guidelines of the wood flooring manufacturer
Curing Rate
3.5 mm/24 hours approx. (23 °C / 50% r.h.) |
Skin Time / Laying Time
60 minutes approx. (23 °C / 50% r.h.) |
Consumption
Sika® AcouBond®-System:
- 400–500 ml/m2 approx. for SikaLayer®-03 and 500–600 ml/m2 approx. for SikaLayer®-05. All cut-outs must be filled out. Use a triangular nozzle with a 8 x 10 mm opening.
Full Surface Bonding with SikaBond® Dispenser-1800 /-3600 /-5400:
- For full surface bonding with the SikaBond® Dispenser please refer to the Method Statements of the SikaBond® Dispenser series.
Beaded Application:
- 44 ml approx. per running meter consumes 250–500 g/m2, depending on bead spacing (solid wood boards, 3-ply engineered wood, chipboards).
For substrates primed with Sika® Primer MB and/or Sika® Primer MR Fast, the consumption of SikaBond®-52 Parquet may be reduced.
APPLICATION INSTRUCTIONS
For the application of SikaBond®-52 Parquet all standard construction guidelines apply.
For further information, please refer to the Method Statements "Full Surface Bonding" and "SikaBond® Dispenser".
SUBSTRATE PREPARATION
- The substrate must be clean, dry, sound and homogeneous, free from oils, grease, dust and loose or friable particles. Paint, cement laitance and other poorly adhering contaminants must be removed.
- Concrete and/or cement screeds must be ground and thoroughly cleaned with an industrial vacuum.
- Anhydrite screeds, including flowable anhydrite screeds must be ground and thoroughly cleaned with an industrial vacuum shortly before bonding with the adhesive starts.
- Broadcast mastic asphalt must be primed with Sika® Primer MR Fast or Sika® Primer MB. For the instructions for use, please refer to the corresponding Product Data Sheet.
- Glazed ceramic and old existing ceramic tiles must be degreased and cleaned with Sika® Aktivator-205, or the tile surfaces must be ground and then thoroughly cleaned with an industrial vacuum.
- Wood and/or gypsum boards (e.g. chipboard, plywood) must be glued and/or screwed to the substructure in order to be fixed to the substrate. For floating dry-floors, contact our Technical Service Department.
- Other substrates: contact our Technical Service Department for advice and assistance.
- SikaBond®-52 Parquet can be used without priming on cement based floors, anhydrite floors, chipboards, concrete and ceramic tiles.
- For broadcasted mastic asphalt, cement based floors with excessive moisture content and use over old adhesive residues or on weak substrates use Sika® Primer MB. For detailed instructions contact our Technical Service Department.
CLEANING OF TOOLS
Clean all tools and application equipment immediately after use with Sika® Remover-208 and/or Sika® TopClean T. Once cured, residual material can only be removed mechanically.